Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel

ABSTRACT

Transfer of liquid crystal panels to next processes is carried out with the panels placed on transfer arms ( 6 ) and held by suction pads ( 12 ). A small suction force can be sufficient, and a suction irregularity is prevented. Transfer arms are arranged at the lower side of liquid crystal panels, thus not obstructing the liquid crystal panels. In arranging the liquid crystal panels to an image pickup device ( 111 ), a panel hold device ( 112 ) is controlled to drive to position panel marks to a bonding height position with negating a deflection amount of the liquid crystal panels, and furthermore a component hold device is controlled to drive to position component marks to the bonding height position and to mount electronic components to the liquid crystal panels at the bonding height position. Thus, an accuracy for mounting electronic components can be improved in comparison with the conventional art.

DESCRIPTION

[0001] Component Mounting Apparatus and Component Mounting Method, And, Recognition Apparatus For Component Mount Panel, Component Mounting Apparatus For Liquid Crystal Panel, And Component Mounting Method For Liquid Crystal Panel

[0002] 1. Technical Field

[0003] The present invention relates to a component mounting apparatus and a component mounting method with a transfer mechanism for mounting a component to a liquid crystal panel or the like. Further The present invention relates to a recognition apparatus for component mount panel for picking up and then recognizing images of both a panel, e.g., liquid crystal panel or the like and an electronic component mounted thereon, a component mounting apparatus for liquid crystal panel with the recognition apparatus for component mount panel, and a component mounting method for liquid crystal panel carried out by the component mounting apparatus for liquid crystal panel.

[0004] 2. Background Art

[0005] There have conventionally been known electronic component mounting apparatuses for mounting electronic components to objects while transferring with the use of arms the objects to which the electronic components are to be mounted. There is, for example, the electronic component mounting apparatus of a type which mounts TCPs (Tape Carrier Package) to liquid crystal panels.

[0006]FIG. 19 is a perspective view of the whole of the conventional electronic component mounting apparatus of one example. The electronic component mounting apparatus 51 shown in the figure is an apparatus for mounting the TCPs to liquid crystal panels, which includes an ACF attachment part 52, a TCP temporary pressure bonding part 53, and a TCP permanent pressure bonding part 54. Transfer arms 55 are set so as to transfer liquid crystal panels. A liquid crystal panel handed to the transfer arm from outside the apparatus is sequentially sent to the adjacent transfer arm after completely processed at each of the parts 52-54, so that the liquid crystal panel is transferred in a direction of an arrow “a”.

[0007] A perspective view of FIG. 20 concretely illustrates how the transfer arm holds the liquid crystal panel. A suction pad (not shown) is formed to a disc part 55 a of the transfer arm 55. The liquid crystal panel 60 is held by the transfer arm 55 from above, i.e., from the side of a display face through vacuum suction by the suction pad.

[0008] The liquid crystal panel 60 held in this state can be transferred in the direction of the arrow “a” (FIG. 19), in other words, can be transferred to the adjacent next process. Concretely, the liquid crystal panel 60 completely finished at each part such as the ACF attachment part 52 or the like is transferred in a direction of an arrow “b” by a panel stage 56 set below the liquid crystal panel 60, and is brought into a state of FIG. 20.

[0009] In the state, the liquid crystal panel 60 is delivered to the transfer arm 55 which in turn holds the liquid crystal panel 60 from above. The liquid crystal panel is then transferred in the arrow “a” direction. The liquid crystal panel 60 having an ACF attached thereto by the ACF attachment part 52 is transferred to a position opposite to the TCP temporary pressure bonding part 53 which is the next process.

[0010] However, the conventional electronic component mounting apparatus as above has problems as follows. Liquid crystal panels have been increasingly made large and thinned in these days, thus necessitating to increase a hold force by the transfer arm 55, namely, a vacuum suction force by the suction pad correspondingly. This increase of the hold force brings about an irregularity (shaded parts c) in suction by the suction pad to the periphery of the suction pad, and the suction irregularity leads to a display irregularity in highly fine and high-quality liquid crystal panels, with lowering an image quality.

[0011] The liquid crystal panels must be removed from the apparatus in case of maintenance. However, the transfer arms 55 above the liquid crystal panels make it impossible to remove the liquid crystal panels even when the conventional electronic component mounting apparatus as above comes to a halt because of a failure or the like, or require complicate work even if it is possible.

[0012] The present invention is devised to solve the problems inherent in the prior art, and has for its first object to provide an electronic component mounting apparatus which can prevent damages to objects to which electronic components are to be mounted by holding the objects from below when transferring the objects, with a maintainability improved.

[0013] The above-described conventional component mounting apparatus still includes problems as below. That is, there is a liquid crystal panel 71, for instance, having a liquid crystal display part 74 set to a substrate of a glass plate 73 as shown in FIG. 22. An electronic component 72 for operating the liquid crystal display part 74 is mounted to a periphery of the liquid crystal display part 74, more specifically, a side edge part 73 a of the glass plate 73. For mounting the electronic component 72 to a component mount position of the side edge part 73 a, as indicated in FIG. 23, an image of a panel mark on the side edge part 73 a is picked up and recognized by a camera 75, while an image of a component mark on the electronic component 72 is picked up and recognized by, e.g., the same camera 75. On the basis of the recognition results of the panel mark and component mark, a location of the liquid crystal panel 71 is corrected with a panel hold device 76 which holds the liquid crystal panel 71 and corresponds to the panel stage, which is achieved by moving the panel 71 in X and Y directions and moreover rotating the panel 71 about an axis of a shaft 77 of the panel hold device 76. At the same time, the electronic component 72 is rotated about an axis of a component hold member 78 holding the electronic component 72, thereby being corrected in position. The electronic component 72 is mounted to the specific component mount position in this manner.

[0014] As shown in FIG. 23, conventionally, the liquid crystal panel 71 is held at its nearly central part by a hold part 79 of the panel hold device 76. Since the panel hold device 76 is movable in the X and Y directions as mentioned above, the hold part 79 is limited in size in order to avoid interference with other devices.

[0015] Under the circumstances, while the liquid crystal panels of a several-cm square used in, for example, mobile phones or the like are accompanied with no problem, in the liquid crystal panel 71 having the substrate 73 of glass of a large size not smaller than 10 inches, e.g., 15 inches or 21 inches, a large amount of deflection at the component mount position is arisen when the large size panel 71 is held by the hold part 79 as shown in FIG. 24. Therefore an error corresponding to the deflection amount is generated between when the liquid crystal panel 71 is picked up by the camera 75 and when the electronic component 72 is mounted to the liquid crystal panel 71. Accordingly, in the liquid crystal panel 71 of the large size, the deflection amount consequently affects the position correction of the liquid crystal panel 71 as above, making it difficult to mount the electronic component 72 to the specified component mount position.

[0016] In addition, since latest liquid crystal panels 71 have been made thinner and lighter in weight, the deflection amount of the liquid crystal panels 71 is apt to increase as well as in consequence of the above size increase, as shown in FIG. 25. The deflection amount is hence considered to further hinder the electronic component 72 from being mounted to the specified component mount position. The deflection amount indicated in FIG. 25 is a size between an uppermost end and a lowest end of the deflected liquid crystal panel.

DISCLOSURE OF INVENTION

[0017] The present invention is devised to solve the aforementioned problem and has for its second object to provide a recognition apparatus for component mount panel, a component mounting apparatus for liquid crystal panel, and a component mounting method for liquid crystal panel for being able to mount a component to specified component mount positions even if panels are deflected.

[0018] In order to accomplish the above first object, the present invention is constituted as follows.

[0019] According to a component mounting apparatus of a first aspect of the present invention, there is provided a component mounting apparatus for mounting components to objects through a plurality of processes, which comprises:

[0020] transfer devices for transferring each of the objects between the processes, each of transfer devices having transfer arms with suction devices on which each of the objects is loaded and at the same time held by the suction devices, when each of the objects is transferred between the processes.

[0021] According to the component mounting apparatus as above, the object is transferred while held from the lower side. Therefore, the suction force for the holding can be small as compared with the case where the object is held at the upper side, whereby the suction irregularity due to the action of the suction force is prevented. Since the transfer device is placed to the lower side of the object, there is no particular obstruction to taking out the object from the apparatus. Even if the apparatus stops due to a failure or the like, the work of taking out the object from the apparatus is facilitated and the superior maintainability is exerted.

[0022] In the above component mounting apparatus, preferably the transfer devices are arranged at positions opposite to working areas of the processes respectively, and transfer the objects completely processed at the working areas to positions opposite to next working areas after the objects are delivered to the transfer devices.

[0023] The component mounting apparatus preferably includes move devices for supporting the objects at their lower side and moving the objects at least in an up-and-down and back-and-forth directions, and delivering the objects completely processed at the working areas to the transfer devices.

[0024] Preferably, each of the move devices raises each of the objects loaded on the transfer arms up from the transfer arms and transfers the object to the working areas of processes, and transfers the objects to a higher position than the transfer arms above the transfer arms after completely finished at the working areas, lowers the object and places the object again on the transfer arms.

[0025] Further, each of the transfer devices may have two transfer arms for supporting the object at both end parts thereof. According to the above component mounting apparatus, a suction irregularity at a central part of the object can be perfectly prevented.

[0026] Further, the suction devices may hold the object by vacuum suction. According to the above component mounting apparatus, holding is made sure.

[0027] Further, each of the suction devices may have pad parts, formed of a buffering material with upper end faces upper than a surface of the transfer arm, for sucking the object. According to the component mounting apparatus, sure suction is ensured even when a flatness of the transfer arms and the objects varies.

[0028] Further, the object may be a flat display panel.

[0029] According to a second aspect of the present invention, there is provided a component mounting method for mounting components to objects through a plurality of processes, the method comprising:

[0030] holding lower sides of each of the objects; and

[0031] transferring the held objects between the processes.

[0032] According to the above component mounting method, since the object is held at the lower side, a suction force for holding the object can be smaller because of a weight of the object than when the object is held at the upper side, thus preventing a suction irregularity by the action of the suction force. Since transfer devices are set to the lower side of the objects, nothing hinders when the objects are to be taken out from the apparatus. Taking out the objects from the apparatus is facilitated even if the apparatus stops by a failure or the like, and a superior maintainability is exerted.

[0033] In the above method, the transfer may be carried out with the use of transfer devices having transfer arms with suction devices in a state while the object is placed on the transfer arms and at the same time held by the suction devices.

[0034] Also preferably, the object loaded on the transfer arms are raised up, thereby being separated from the transfer arms, then transferred to working areas of the processes, transferred to a higher position than the transfer arms above the transfer arms after completely finished at the working areas of the processes, lowered the object and placed the object again on the transfer arms.

[0035] In order to accomplish the above second object, a recognition apparatus for component mount panel is provided according to a third aspect of the present invention, which comprises:

[0036] an image pickup device for picking up images of panel marks on a panel to which a component is to be mounted, in a state while the panel marks are arranged at a bonding height position in a thickness-direction of the panel when the component is mounted on the panel;

[0037] a panel hold device for holding and moving the panel to arrange the panel at the image pickup device for the image pickup; and

[0038] a control device for controlling the panel hold device to move to position the panel marks to the bonding height position with negating a deflection amount generated to the panel as a result of being held by the panel hold device when the panel is to be arranged at the image pickup device.

[0039] The image pickup device may comprise a light-passing stage where the panel is loaded to arrange the panel marks at the bonding height position when the panel marks are to be picked up, and cameras disposed opposite to the panel via the stage for picking up images of the panel marks through the stage.

[0040] Further, the panel marks are set by two, and the cameras may have a fixed camera for picking up the image of one of the panel marks and a moving camera for picking up the image of the other panel mark which is movable to conform to an interval between the other mark and the one mark of the panel marks.

[0041] A component mounting apparatus for liquid crystal panel provided according to a fourth aspect of the present invention, which comprises:

[0042] an image pickup device for picking up images of panel marks on a panel to which a component is to be mounted, in a state while the panel marks are arranged at a bonding height position in a thickness-direction of the panel when the component is mounted to the panel, and moreover picking up images of component marks on the component in a state while the component marks are arranged at the bonding height position;

[0043] a panel hold device for holding and moving the liquid crystal panel to arrange the liquid crystal panel at the image pickup device for the image pickup;

[0044] a component hold device for holding and moving the component to arrange the component marks of the component at the bonding height position by the image pickup device for the image pickup, and moreover mounting the held component to the liquid crystal panel at the bonding height; and

[0045] a control device for controlling the panel hold device to arrange the panel marks at the bonding height position with negating a deflection amount generated to the liquid crystal panel because of being held by the panel hold device when the liquid crystal panel is to be arranged at the image pickup device.

[0046] In the component mounting apparatus for liquid crystal panel according to the above fourth mode, the image pickup device may have a light-passing stage on which the panel is loaded to arrange the panel marks at the bonding height position when the panel marks are to be picked up and which becomes a support stage in mounting the component to the liquid crystal panel, and cameras disposed opposite to the panel and the component via the stage for picking up images of the panel marks and the component marks through the stage.

[0047] In the component mounting apparatus for liquid crystal panel of the fourth aspect, the panel marks and the component marks are set each by two, and the cameras may have a fixed camera for picking up images of either ones of the panel marks and component marks, and a moving camera for picking up images of the other ones of the panel marks and component marks which is movable to conform to an interval between the other mark and the one mark of the panel marks and component marks.

[0048] In the component mounting apparatus for liquid crystal panel of the fourth aspect, the deflection amount is a value set for each side of the liquid crystal panel, so that the control device may control the panel hold device on the basis of the deflection amount set for the side where the panel marks to be recognized are present.

[0049] In the component mounting apparatus for liquid crystal panel according to the fourth aspect, the deflection amount is a value set at a mount portion for the component, so that the control device may control the panel hold device on the basis of the deflection amount set at the mount portion for the component.

[0050] The component mounting apparatus for liquid crystal panel according to the fourth aspect may further include a deflection detection device for detecting the deflection amount of the mount portion for the component at the liquid crystal panel before the liquid crystal panel is disposed to the image pickup device, so that the control device controls the panel hold device on the basis of the deflection amount supplied from the deflection detection device.

[0051] According to a component mounting method for liquid crystal panel of a fifth aspect of the present invention, the method comprises:

[0052] holding a liquid crystal panel to which a component is to be mounted;

[0053] loading the liquid crystal panel to a light-passing stage as a support stage in a state where a deflection of the liquid crystal panel generated by the holding is eliminated; and

[0054] mounting the component onto the liquid crystal panel loaded on the stage.

[0055] According to the recognition apparatus for component mount panel in the third aspect of the present invention as described hereinabove, the control device controls the panel hold device to negate the deflection amount generated to the panel when held by the panel hold device and to position the panel marks to the bonding height position when the panel is arranged at the image pickup device. Since the panel is in a state free from the deflection when the panel marks are picked up, the panel marks can be picked up with the higher accuracy than conventionally.

[0056] According to the component mounting apparatus for liquid crystal panel in the fourth aspect and the component mounting method for liquid crystal panel in the fifth aspect of the present invention, there are arranged the image pickup device, the panel hold device, the component hold device, and the control device. The control device controls the panel hold device to operate to negate the deflection amount generated to the liquid crystal panel when held by the panel hold device and to position the panel marks to the component bonding height when the liquid crystal panel is arranged at the image pickup device, and moreover, the control device makes the component hold device mount components to the liquid crystal panel at the bonding height position with the component marks positioned to the bonding height position. Accordingly the panel marks can be picked up in a state without any deflection to the liquid crystal panel. Moreover, the position where the panel marks and the component marks are picked up are made equal to the position where the component is to be mounted to the liquid crystal panel. Thus, unnecessary operations for moving the panel hold device and the component hold device are reduced, so that the accuracy for mounting components can be improved as compared with the prior art.

BRIEF DESCRIPTION OF DRAWINGS

[0057] These and other aspects and features of the present invention will become clear from the following description taken in conjunction with the preferred embodiments thereof with reference to the accompanying drawings, in which:

[0058]FIG. 1 is a perspective view showing the whole of a component mounting apparatus according to a first embodiment of the present invention;

[0059]FIG. 2 is a perspective view for explaining a transfer method for liquid crystal panels in the above first embodiment;

[0060]FIG. 3 is a perspective view of a leading end of a transfer arm in the above first embodiment;

[0061]FIG. 4 is a side view of the leading end of the transfer arm in the above first embodiment;

[0062]FIG. 5 is a side view of a liquid crystal panel in a state where the transfer arm holds the panel in the above first embodiment;

[0063]FIG. 6 is a diagram showing a transfer method for liquid crystal panels at each process in the above first embodiment;

[0064]FIG. 7 is a diagram showing a transfer method for liquid crystal panels at each process in the above first embodiment;

[0065]FIG. 8 is a diagram showing a transfer method for liquid crystal panels at each process in the above first embodiment;

[0066]FIG. 9A is a schematic plan view of the component mounting apparatus in the above first embodiment;

[0067]FIG. 9B is a schematic plan view of the component mounting apparatus in the above first embodiment;

[0068]FIG. 10 is a perspective view of a liquid crystal recognition apparatus in a second embodiment of the present invention;

[0069]FIG. 11 is a front view showing a state in which an image pickup device shown in FIG. 10 picks up an image of an electronic component;

[0070]FIG. 12 is a side view showing a state in which the image pickup device shown in FIG. 10 picks up an image of a liquid crystal panel;

[0071]FIG. 13 is a front view showing the state in which the image pickup device shown in FIG. 10 picks up the image of the liquid crystal panel;

[0072]FIG. 14 is a view of a state in which the liquid crystal panel deflects when held by a panel hold apparatus shown in FIG. 10;

[0073]FIG. 15 is a perspective view of a component mounting apparatus for liquid crystal panel according to the other embodiment of the present invention;

[0074]FIG. 16 is a flow chart showing the operation of the component mounting apparatus for liquid crystal panel of FIG. 15;

[0075]FIG. 17 is a diagram of a modified example of the image pickup device of FIG. 10;

[0076]FIG. 18 is a diagram of a modified example having a deflection detection device of the liquid crystal panel recognition apparatus of FIG. 10;

[0077]FIG. 19 is a perspective view of an example of a conventional electronic component mounting apparatus;

[0078]FIG. 20 is a perspective view showing an example of a conventional transfer method for liquid crystal panels;

[0079]FIG. 21 is a perspective view showing an example of a state in which the liquid crystal panel is held in the conventional art;

[0080]FIG. 22 is a perspective view of the liquid crystal panel;

[0081]FIG. 23 is a diagram of a recognition operation for the liquid crystal panel in the conventional component mounting apparatus;

[0082]FIG. 24 is a diagram showing a state in which an image pickup operation is carried out with the liquid crystal panel deflected in the conventional component mounting apparatus; and

[0083]FIG. 25 is a graph showing a relationship of a size and a deflection amount of the liquid crystal panel.

BEST MODE FOR CARRYING OUT THE INVENTION

[0084] These and other objects and features of the present invention will become clear from the following description taken in conjunction with the preferred embodiments thereof with reference to the accompanying drawings, in which like parts are designated by like reference numerals.

[0085] A first embodiment of the present invention will be detailed hereinbelow with reference to the drawings.

[0086]FIG. 1 is a perspective view of the whole of an electronic component mounting apparatus according to a first embodiment of the present invention. The electronic component mounting apparatus 1 shown in FIG. 1 is an apparatus for mounting ICs (or TCPs) to a liquid crystal panel. The embodiment exemplifies ICs as components to be mounted.

[0087] The electronic component mounting apparatus 1 includes an ACF attachment part 2, an IC temporary pressure bonding part 3, an IC permanent pressure bonding part 4, and an IC permanent pressure bonding part 5. The ACF attachment part 2 carries out a process of affixing an ACF (Anisotropic Conductive Film) to a liquid crystal panel. The IC temporary pressure bonding part 3 carries out a process of temporarily joining ICs to the liquid crystal panel, in which marks set to the liquid crystal panel and to the ICs are recognized to register the ICs and the liquid crystal panel. The IC permanent pressure bonding parts 4 and 5 carry out a process of permanent joining the ICs to the liquid crystal panel while heating and pressuring each of ICs with the use of a press head. As above, the electronic component mounting apparatus 1 mounts each IC to the liquid crystal panel through a plurality of processes, i.e., the attachment process for ACF, the next temporary pressure bonding process for ICs, the next permanent pressure bonding process for ICs. Each operation carried out by the electronic component mounting apparatus 1 is controlled by a control device 30.

[0088] The operation in each process as above is conducted in a state with the liquid crystal panel transferred to each working position corresponding to the each process of the above parts 2-5 constituting the apparatus. The transfer of the liquid crystal panel within each process is performed in a state while a lower side of the liquid crystal panel, namely, a non display side is held on a panel stage 7 and, the panel stage 7 is moved in up-down directions in parallel to a thickness-direction of the liquid crystal panel, and in back-and-forth directions orthogonal to both the thickness-direction and a longitudinal direction to be depicted below. In contrast, the transfer between processes, that is, the transfer to each next process is carried out by moving the liquid crystal panel held on transfer arms 6 into the longitudinal direction of the apparatus.

[0089] The transfer between processes will be depicted in detail with reference to FIGS. 2-5. FIG. 2 is a perspective view concretely showing a method for transferring the liquid crystal panel between processes in the present embodiment. FIG. 2 shows a part of the transfer arms 6 in FIG. 1. Since the transfer arms 6 in FIG. 1 are schematically illustrated and then shapes in each of portions shown in FIGS. 1 and 2 are not necessarily identical, a fresh reference numeral will be allotted to explain the method.

[0090] Each of liquid crystal panels 8 is placed on two transfer arms 9 arranged in parallel to each other in the embodiment. Therefore, the liquid crystal panel 8 is supported at both end parts at the side of a non display face. Although detailed later, the liquid crystal panel 8 is held on the transfer arms 9 by suction devices formed to the transfer arms 9. The transfer arm 9 can be moved in an arrow direction (right-left direction) in FIG. 2 by a driving device 20 controlled in operation by the control device 30. The transfer arms 9 with the driving devices 20 and, the control device 30 constitute an example of a transfer device.

[0091] The driving device 20 has, for example, a ball screw mechanism in the embodiment as shown in FIG. 1, which is provided with a screw 20 a, a motor 20 b as a driving source and, a nut part 20 c which engages with the screw 20 a, is moved in a direction of an arrow 155 along the screw 20 a by driving the motor 20 b and has the transfer arms 9 set thereto. As illustrated, the driving device 20 includes a driving device 20-1 of the temporary bonding side set corresponding to the ACF attachment part 2 and the IC temporary pressure bonding part 3, and a driving device 20-2 of the permanent bonding side set corresponding to the IC permanent pressure bonding parts 4 and 5. The driving device 20-1 of the temporary bonding side has two pairs of the transfer arms 9 as indicated in the drawing when two transfer arms 9 are paired. On the other hand, the driving device 20-2 at the permanent bonding side has three pairs of transfer arms 9. One pair of the transfer arms present closest to the driving device 20-1 at the temporary bonding side among the three pairs is constituted to be movable between the IC temporary pressure bonding part 3 and the IC permanent pressure bonding part 4. The driving device 20-1 at the temporary bonding side and the driving device 20-2 at the permanent bonding side are controlled by the control device 30 to operate not to interfere with each other.

[0092] Although the transfer arms 9 of each pair are disposed mutually parallel in the embodiment as described hereinabove, a layout is not limited to the parallel one so long as the transfer arms 9 do not interfere with a panel stage 10 to be described later.

[0093] According to the above constitution, the liquid crystal panel 8 can be transferred to a direction of an arrow “e” (FIG. 1) while being held on the transfer arms 9. Namely, in this holding state, the liquid crystal panel 8 is transferred to an adjacent next process.

[0094] When the liquid crystal panel 8 is held at its lower side as described above, a weight of the liquid crystal panel 8 is applied onto the transfer arms 9, and consequently a suction force for holding the panel 8 can be made smaller than when the liquid crystal panel is held at the upper side. A suction irregularity resulting from the action of the suction force is prevented accordingly. Especially when the liquid crystal panel 8 is held at both end parts thereof as in the present embodiment, the suction irregularity at a central part of the liquid crystal panel can be perfectly prevented.

[0095] In the embodiment, the transfer device is always present at the lower side of the liquid crystal panel 8, thus causing no particular obstruction to taking out the liquid crystal panel 8 from the apparatus. Even if the apparatus stops because of a failure or the like reason, the liquid crystal panel 8 can be taken out easily from the apparatus. Thus, the apparatus has a superior maintainability.

[0096] Suction of the liquid crystal panel 8 by the transfer arms 9 will be described with reference to FIGS. 3-5. FIG. 3 is a perspective view of a leading end side of the transfer arm 9, and FIGS. 4 and 5 are views seen from a direction of an arrow A of FIG. 3. As shown in FIGS. 3 and 4, the transfer arm 9 has suction pads 12 stored in holes 11 formed with countersunk holes. The suction pads 12 are formed of a buffering material such as silicone rubber or the like.

[0097] A leading end face 12 a of the suction pad 12 is set to be higher by, e.g., approximately 1 mm than a surface of the transfer arm 9. Because if the leading end face 12 a is made even with the surface of the transfer arm 9, secure suction is hindered in the event that each flatness of the transfer arm 9 and the liquid crystal panel 8 varies. That is, when the leading end face 12 a is made slightly higher, the suction pad 12 of the buffering material can be turned ready to trace the liquid crystal panel 8, therefore the variation in flatness can be absorbed to make the suction sure.

[0098] A vacuum path 12 b connected to the suction pads 12 is formed in each transfer arm 9, to which is connected the suction device 21 controlled by the control device 30 in operation. The leading end face 12 a of the suction pad 12 comes in contact with the liquid crystal panel 8, whereby the liquid crystal panel 8 is held on each transfer arm 9 through vacuum suction by the suction device 21 via the vacuum path 12 b. The suction pads 12, the vacuum path 12 b, the suction device 21, and the control device 30 constitute an example of an adhesion suction device.

[0099]FIG. 5 shows a state in which the liquid crystal panel 8 is held by the transfer arms 9. The liquid crystal panel 8 sinks by its own weight in this state. Therefore, the suction pads 12 of the buffering material sufficiently fit the liquid crystal panel 8, with surely holding the liquid crystal panel 8. Since the liquid crystal panel 8 comes in contact with the transfer arm 9 in a manner that the suction pad 12 of the buffering material sink without coming directly in face contact with each other, so that damages to the liquid crystal panel 8 can be prevented.

[0100] Referring to FIGS. 6-8, transfer of the liquid crystal panel within each process will be described below. FIGS. 6-8 are views seen from a direction of an arrow B of FIG. 2 and indicate the liquid crystal panel completely processed in each process before delivered to the transfer arms 9. For instance, the liquid crystal panel 8 having the ACF completely attached by the ACF attachment part 2 as an example of the each process is transferred while held at the lower side by the panel stage 10 through vacuum suction to a place where the liquid crystal panel 8 is positioned to immediately above the transfer arms 9, as indicated in FIG. 6. The panel stage 10 is connected to a suction device 22 controlled in operation by the control device 30, is moved up and down by a first driving device 10 b controlled in operation by the control device 30 and moreover moved in directions of arrows f and g described later by a second driving device 10 c controlled in operation by the control device 30. The panel stage 10 with the first and second driving devices 10 b and 10 c, the suction device 22, and the control device 30 constitute an example of a move device.

[0101] A shaft 10 a integral with the panel stage 10 is lowered from the state in the thickness-direction of the liquid crystal panel 8 by the driving part 10 b, whereby a lower face of the liquid crystal panel 8 comes into contact with the leading end face 12 a of the suction pad 12 as shown in FIG. 5. Eventually the liquid crystal panel 8 is held to the transfer arms 9 as shown in FIG. 7. In this state, the vacuum suction force is applied with the transfer arms 9 to the liquid crystal panel 8, whereas the vacuum suction with the panel stage 10 is released.

[0102] When the shaft 10 a is further lowered in the arrow direction in parallel to the thickness-direction, as shown in FIG. 8, the panel stage 10 completely separates from the liquid crystal panel 8, and the liquid crystal panel 8 is completely delivered to the transfer arms 9.

[0103] Inversely, for example, when the liquid crystal panel 8 held by the pair of the transfer arms 9 and disposed to meet the ACF attachment part 2 is to be transferred towards the ACF attachment part 2, the shaft 10 a is moved up by the driving part 10 b in an opposite direction to the arrow along the thickness-direction from the state shown in FIG. 8, then is driven from the state of FIG. 7 to the state of FIG. 6. The panel stage 10 is moved to the arrow f direction at a time point when the liquid crystal panel 8 is finished to be delivered from the pair of the transfer arms 9 to the panel stage 10.

[0104] The transfer of the liquid crystal panel 8 between processes and, the transfer within each process are separately described hereinabove. The operation in the entire apparatus will now be depicted with the use of FIG. 9A and FIG. 9B. The operation of the electronic component mounting apparatus 1 is controlled by the control device 30. As described above, the transfer arms 9 and the panel stage 10 are both positioned to the side of the non display face of the liquid crystal panel 8, and therefore avoiding mutual interference is particularly required. The transfer arms 9 and panel stage 10 operate as will be described below while being controlled by the control device 30. FIGS. 9A and 9B are a schematic simplified plan view of each part of the electronic component mounting apparatus 1 in FIG. 1. The transfer arm will be denoted by the reference numeral “6” again in FIGS. 9A, 9B and in the following description with reference to FIGS. 9A, 9B.

[0105] In a state indicated in FIG. 9A, each of liquid crystal panels 8 a-8 e is held on the transfer arms 6. This is the state after the liquid crystal panels 8 b-8 e in the electronic component mounting apparatus 1 are transferred in the arrow f direction, arranged at positions indicated by chain double-dashed lines, completely finished in the corresponding processes by the constituent parts 2-5, and then transferred in the arrow g direction from the positions of the chain double-dashed lines. The liquid crystal panels 8 a and 8 b are held respectively by the pair of transfer arms 6 of the driving device 20-1 at the temporary bonding side, while the liquid crystal panels 8 c-8 e are held respectively by the pair of transfer arms 6 of the driving device 20-2 at the permanent bonding side. The directions of the arrows f and g are orthogonal to both the transfer direction along the arrow direction 155 and the thickness-direction. The transfer in the arrow f and g directions is carried out while the liquid crystal panels 8 are raised by the panel stages 10 from the transfer arms 6. In this state, the liquid crystal panel 8 a transferred from a different facility outside the electronic component mounting apparatus 1 is delivered to the pair of the transfer arms 6 of the driving device 20-1 at the temporary bonding side.

[0106] When the panel stage 10 and the transfer arms 6 are brought to a state at least not to interfere with each other by the operation control of the control device 30, that is, when the panel stage 10 descends to a level not to obstruct the transfer operation of the transfer arms 6, each transfer arm 6 moves in a direction shown by the arrow e into a state shown in FIG. 9B. Specifically, as indicated by arrows of dashed lines, each of the liquid crystal panels 8 a-8 e is transferred to a position shown in FIG. 9B from a position shown in FIG. 9A in the arrow direction e of the electronic component mounting apparatus 1. Thereafter, each of the liquid crystal panels 8 a-8 d is delivered from the corresponding pair of the transfer arms 6 to the corresponding panel stage 10 from the state of FIG. 9B, and each panel stage 10 is transferred to the arrow f direction of FIG. 9A, so that each liquid crystal panel 8 a-8 d is subjected to each process. During the time, each transfer arm 6 is moved in a direction opposite to the arrow e direction and returned to the state of FIG. 9A. After the transfer arms 6 are moved, each panel stage 10 holding the processed liquid crystal panel 8 is transferred in the arrow g direction and held onto the transfer arms 6 again.

[0107] The liquid crystal panel 8 e transferred to the outside the electronic component mounting apparatus 1 is delivered to a different facility. Liquid crystal panels having ICs mounted are sequentially sent out of the apparatus by repeating the above-described operation.

[0108] As above, each liquid crystal panel is transferred between processes while being held at the lower side by the transfer arms 6, and eventually transferred in the longitudinal direction inside the electronic component mounting apparatus 1. That is, each liquid crystal panel is transferred in the electronic component mounting apparatus 1 at all times in a state while held at the lower side.

[0109] Although the object to which the electronic components are to be mounted is the liquid crystal panel in the foregoing embodiment, the object is not limited to this and the same effect can be obtained for flat display panels such as plasma displays or the like.

[0110] Second Embodiment

[0111] A recognition apparatus for component mount panel, a component mounting apparatus for liquid crystal panel and, a component mounting method for liquid crystal panel in a second embodiment of the present invention will be described with reference to the drawings in which like parts are designated by like reference numerals.

[0112] The present embodiment adopts, as the panel to which components are to be mounted, a panel for liquid crystal display which is formed of a glass substrate such as the one described with reference to FIG. 22. However the panel is not restricted to the liquid crystal panel. Moreover, an electronic component will be discussed as an example functioning as the component.

[0113] A component mounting apparatus 101 for liquid crystal panel with a recognition apparatus for component mount panel, i.e., with a recognition apparatus for liquid crystal panel in this embodiment is shown in FIG. 15. The component mounting apparatus 101 for liquid crystal panel in FIG. 15 corresponds to the above-described electronic component mounting apparatus 1 shown in FIG. 1. In FIG. 15, 150 is an ACF (anisotropic conductive film) attaching apparatus for carrying out an ACF attachment process. The ACF attaching apparatus 150 corresponds to the ACF attachment part 2 in FIG. 1. 110 is a recognition apparatus for liquid crystal panel and 160 is a component hold apparatus, which carry out a temporary pressure bonding process for temporarily bonding components with pressure to liquid crystal panels. The recognition apparatus 110 for liquid crystal panel and the component hold apparatus 160 correspond to the IC temporary pressure bonding part 3 shown in FIG. 1. 151 and 152 are permanent pressure bonding apparatuses for performing a permanent pressure bonding process for permanently bonding the components with pressure to liquid crystal panels. The permanent pressure bonding apparatuses 151 and 152 correspond to the IC permanent pressure bonding part 4 of FIG. 1. 153 is a panel transfer part which can be reciprocated by a ball screw 156 in the direction of the arrow 155. The liquid crystal panel is carried in from the left side of the component mounting apparatus 101 for liquid crystal panel in FIG. 15, subjected sequentially to the ACF attachment process, the temporary pressure bonding process and the permanent pressure bonding process in a direction of an arrow 154, and transferred. The panel transfer part 153 has the transfer arms 6 shown in FIG. 1.

[0114] The ACF attaching apparatus 150 is an apparatus for attaching to the liquid crystal panel the anisotropic conductive film tape which is an adhesive tape including conductive particles and is interposed between the liquid crystal panel and the electronic component to electrically connect electrodes of the electronic component and of the liquid crystal panel by the conductive particles when the electronic component is pressured with heat to the liquid crystal panel.

[0115] The recognition apparatus 110 for liquid crystal panel will be described in detail later. The component hold apparatus 160 holds the electronic component which is to be mounted to a side edge part of the liquid crystal panel 71, registers the electronic component to the side edge part of the liquid crystal panel 71 and temporarily pressure bonds the electronic component to the liquid crystal panel. The permanent pressure bonding apparatuses 151 and 152 permanently join the electronic component to the liquid crystal panel 71 while heating and pressuring the electronic component with the use of a press head.

[0116] The recognition apparatus 110 for liquid crystal panel will be depicted below. The recognition apparatus 110 for liquid crystal panel in the description picks up images of not only the liquid crystal panel 71, but the electronic component 72 because the description here is directed to the component mounting apparatus 101 for liquid crystal panel. However, the recognition apparatus 110 for liquid crystal panel is fundamentally a recognition apparatus for recognizing panels.

[0117] The recognition apparatus 110 for liquid crystal panel roughly comprises an image pickup device 111, a panel hold device 112, and a control device 180 as shown in FIG. 10.

[0118] The recognition apparatus 110 for liquid crystal panel is an apparatus for picking up panel marks 191-1 and 191-2 on the liquid crystal panel 71 which are disposed to a bonding height position 193 as a height-position to mount the electronic component as indicated in FIG. 13, and for picking up component marks 192-1 and 192-2 on the electronic component 72 which are disposed to the bonding height position 193 as in FIG. 11. The marks 191-1, 191-2, 192-1, and 192-2 indicated in FIGS. 11 and 13 can be specially formed for use as recognition marks, or can be specific parts of wirings, electrodes or the like formed on the electronic component 72 and the glass plate 73 beforehand. The marks are slightly exaggerated in each drawing. The bonding height position 193 is a height position of an electronic component mount face 194 at the glass plate 73 in the thickness-direction of the liquid crystal panel 71 where the electronic component 72 is to be mounted on the glass plate 73 of the liquid crystal panel 71, and corresponds to a height position of a mount face 195 of the electronic component 72 when mounted. Since the thickness of the glass plate 73 of the liquid crystal panel 71 may vary when a type of the liquid crystal panel 71 to be processed is changed, the bonding height position 193 is not a constant height position and is the height position of the electronic component mount face 194 when the liquid crystal panel 71 is placed on a stage 1100 which will be described later.

[0119] The panel marks 191-1, 191-2 and component marks 192-1, 192-2 are formed to detect deviations in the X and Y directions between the liquid crystal panel 71 and the electronic component 72 sent into the recognition apparatus 110 for liquid crystal panel and to detect a deviation therebetween about a Z axis in parallel to the thickness-direction of the liquid crystal panel 71. Every two marks are necessary and sufficient. The panel marks 191-1 and 191-2 may be formed for each mount position of the electronic component 72 on the liquid crystal panel 71, or only one pair of the panel marks may be formed for one liquid crystal panel 71.

[0120] The image pickup device 111 roughly comprises a stage 1100, a fixed camera 1201, and a moving camera 1202.

[0121] The stage 1100 becomes a support stage for placing the liquid crystal panel 71 thereon with the panel marks 191-1 and 191-2 faced thereto in picking up images of the panel marks 191-1 and 191-2 on the liquid crystal panel 71. The stage has a panel load flat face 1101 on which the liquid crystal panel 71 can be placed, as shown in FIGS. 10 and 12, and the stage is the light-passing support stage formed of quartz of a trapezoidal section in the embodiment. When the liquid crystal panel 71 is placed on the stage 1100, the panel marks 191-1 and 191-2 are positioned to the bonding height 193. Therefore, when the panel marks 191-1, 191-2 and the component marks 192-1, 192-2 on the electronic component 72 are to be picked up by the fixed camera 1201 and moving camera 1202, the images are picked up through the stage 1100. Furthermore, although the electronic component 72 is pressed down to the liquid crystal panel 71 when the electronic component 72 is to be mounted on the liquid crystal panel 71, the stage 1100 operates as the support stage for supporting the liquid crystal panel 71 at this time.

[0122] Each of the fixed camera 1201 and moving camera 1202 has a camera 1203 as an image pickup part equipped with, for example, a CCD (charge coupled device) as shown in FIG. 10 for picking up images of the above marks 191-1, 191-2 and 192-1, 192-2, an illumination device 1204 for image pickup, and a mirror 1205 for reflection. The fixed camera and moving camera are arranged to be opposite to each other on an equal line. As shown in FIGS. 11-13, the fixed camera 1201 and moving camera 1202 are arranged so that the mirrors 1205 for reflection are positioned below the stage 1100.

[0123] The fixed camera 1201 is fixed to a base plate 1210 of the image pickup device 111. On the other hand, the moving camera 1202 can be moved by a moving device 1206 on the base plate 1210 along the line. The moving device 1206 has a so-called ball screw structure having the moving camera 1202 fixed to a nut part 12062 engaged with a screw part 12061, which moves the moving camera 1202 in a direction of an arrow 1207 along the line by rotating the screw part 12061 about its axis by a motor 12063 as a driving part.

[0124] Each of arrangement intervals between the fixed camera 1201 and moving camera 1202 in the arrow 1207 direction is, as indicated in FIGS. 11 and 13, set so that optical axes from the fixed camera 1201 and moving camera 1202 conform to a distance between the panel marks 191-1 and 191-2 and a distance between the component marks 192-1 and 192-2 in the arrow direction 1207. The arrangement intervals are preliminarily set, for example, for each type of the liquid crystal panels 71 and the electronic components 72 carried into the component mounting apparatus 101 for liquid crystal panel, and the set values of the intervals is stored, e.g., in a memory part 181 of the control device 180. The control device 180 moves the moving camera 1202 to provide the arrangement intervals corresponding to each liquid crystal panel 71 and electronic component 72.

[0125] The illumination device 1204 is specifically equipped with a first light source for illuminating optical axis parts of the fixed camera 1201 and moving camera 1202, and a second light source for illuminating the circumference of the optical axes. The control device 180 controls a luminance at the first and second light sources so that the panel marks 191-1, 191-2 and component marks 192-1, 192-2 can be recognized best.

[0126] As above, since every two marks are provided as the panel marks 191-1, 191-2 and component marks 192-1, 192-2, according to the embodiment, a set of the fixed camera 1202 and the moving camera 1202 is prepared, and each set of the panel marks 191-1, 191-2 and the component marks 192-1, 192-2 is recognized at one time by the fixed camera 1201 and moving camera 1202 disposed beforehand to meet the intervals of the panel marks 191-1 and 191-2 and of the component marks 192-1 and 192-2. The operation in this manner improves a Tact. However, if the Tact improvement is negligible, as shown in FIG. 17, only one moving camera may be prepared, thereby recognizing the panel marks 191-1, 191-2 and the component marks 192-1, 192-2 one by one by moving the moving camera.

[0127] For avoiding interference of reflection mirrors 1205 of the moving camera 1202 and the fixed camera 1201 when the moving camera 1202 approaches the fixed camera 1201, and enabling the cameras approach more closer, as shown in FIG. 11, the fixed camera 1201 and moving camera 1202 are disposed with optical axes 1208 and 1209 shifted in the thickness-direction of the liquid crystal panel, i.e., in the Z direction. In the embodiment, a minimum interval in the arrow 1207 direction between the panel marks 191-1 and 191-2 and between the component marks 192-1 and 192-2 is set to be 10mm. The fixed camera 1201 and moving camera 1202 can be aligned to meet the minimum interval.

[0128] Further, the base plate 1210 with the fixed camera 1201 and moving camera 1202 loaded thereon can be moved in the arrow 1207 direction by a motor 1211 as a driving part.

[0129] The camera 1203, the illumination device 1204, and the motor 12063 are connected to the control device 180 and controlled in operation by the control device 180.

[0130] The panel hold device 112 is a device for holding the liquid crystal panel 71 carried into the recognition apparatus 110 for liquid crystal panel and for moving and arranging the held liquid crystal panel 71 to the image pickup device 111 so that the panel marks 191-1 and 191-2 are recognized by the image pickup device 111. The panel hold device includes a hold part 1121, an XY-driving part, a Z-driving part 1123, and a θ-driving part.

[0131] The hold part 1121 holds the liquid crystal panel 71 at the side of a stage contact face 196 to the stage 1100 through suction by a suction device 1122 in the embodiment. The XY-driving part moves the liquid crystal panel in the X and Y directions along a plane of the liquid crystal panel 71, and the Z-driving part 1123 moves the liquid crystal panel 71 in the Z direction which is the thickness-direction of the liquid crystal panel 71. The θ-driving part moves the liquid crystal panel 71 in a θdirection, namely, in a direction about the Z axis. These hold part 1121, XY-driving part, Z-driving part 1123, and θ-driving part are connected to the control device 180 and controlled in operation by the control device 180.

[0132] In FIG. 10, a relative size of the devices is not illustrated in conformity with an actual size of the devices in order to show the image pickup device 111, the panel hold device 112, etc. For instance, the hold part 1121 actually holds approximately a central part of the liquid crystal panel 71 and is larger in size than illustrated.

[0133] As discussed with reference to FIG. 12, in accordance with the liquid crystal panel 71 being increased in size, thinned and reduced in weight, the amount of deflection at a mount portion of the electronic component 72 increases. According to the embodiment, a deflection amount 197 generated as shown in FIG. 14 when the liquid crystal panel 71 to be processed by the component mounting apparatus 101 for liquid crystal panel is held by the panel hold device 112 is measured beforehand. When the liquid crystal panel 71 is placed on the stage 1100 to pick up the image by the image pickup device 111, the control device 180 controls the Z-driving part 1123 of the panel hold device 112 so that the panel marks 191-1 and 191-2 are located at the bonding height 193 with negating the deflection amount 197 generated to the liquid crystal panel 71 as a result of being held by the hold part 1121 of the panel hold device 112. Needless to say, the control device 180 knows beforehand each information on a thickness of the glass plate 73 of the liquid crystal panel 71 held by the hold part 1121 and a height position of the panel load face 1101 of the stage 1100 from a reference height position. Therefore, the control device 180 controls the Z-driving part 1123 on the basis of the thickness of the glass plate 73, height position of the panel load face 1101, and deflection amount 197 to position the panel marks 191-1 and 191-2 to the bonding height 193.

[0134] The deflection amount 197 is stored in the memory part 181 of the control device 180, and read out from the memory part 181 if necessary.

[0135] In the embodiment, the deflection amount 197 is a value preliminarily measured and set for each side where each of the side edge parts 73 a of the liquid crystal panel 71 is present. In controlling the Z-driving part 23, the deflection amount 197 set for the side where the panel marks 191-1 and 191-2 are present is used.

[0136] The liquid crystal panel 71 is put on the stage 1100 also when the electronic component 72 is to be mounted to the side edge part 73 a of the glass plate 73. Therefore, the liquid crystal panel 71 is required to be placed on the stage 1100 with the deflection amount 197 eliminated when the electronic component is to be mounted to the liquid crystal panel. Although the deflection amount 197 set for the side is usable to control to operate the Z-driving part 1123, a value measured and set beforehand at the component mount portion at the side edge part 73 a for the electronic component 72 may be utilized.

[0137] In comparison with the case where the deflection amount 197 set for the side is used, the liquid crystal panel 71 can be less deflected if the deflection amount 197 measured at the component mount portion for the electronic component 72 is used. In other words, the deflection amount is assumed to often differ depending on each component mount portion when a plurality of component mount portions are present at one side. Thus, a stress to the liquid crystal panel 71 can be reduced by using the deflection amount 197 at the individual component mount portion rather than by using the deflection amount uniformly to all component mount portions.

[0138] In an arrangement as shown in FIG. 18, a deflection detection device 250 having a laser distance measurement device is installed above a position where the panel transfer part 153 loads the liquid crystal panel on the panel hold device 112. The deflection amount of the component mount portion at the liquid crystal panel 71 for the electronic component 72 is detected by the deflection detection device 250 with the utilization of the movement subsequent to the carrying in the liquid crystal panel and of the rotational movement for changing a measurement position of the liquid crystal panel before the liquid crystal panel 71 is set to the image pickup device 111. The control device 180 can be adapted to control the panel hold device 112 in operation based on the deflection amount 197 supplied from the deflection detection device 250.

[0139] The deflection detection device 250 is not limited to a non-contact deflection measurement structure using the laser distance measurement device as above. A structure whereby a probe is brought in contact with the liquid crystal panel to measure the deflection amount may be employed. Moreover, a point where the deflection amount is measured by the deflection detection device 250 is not limited to the aforementioned component mount portion, and may be at least one point of each side to obtain the deflection amount of each side of the liquid crystal panel. Alternatively, the deflection amount of, for example, a liquid crystal panel prepared for measuring the deflection amount, or a first produced liquid crystal panel or every predetermined sheets of liquid crystal panels is measured by the deflection detection device 250, and then the measured value may be applied to liquid crystal panels produced afterwards.

[0140] According to this arrangement, the stress produced in the liquid crystal panel 71 can be furthermore reduced.

[0141] Referring to FIG. 16, the operation of mounting components in the component mounting apparatus 101 for liquid crystal panel constituted as above will be discussed hereinbelow including a recognition operation for panel marks 191-1 and 191-2 at the recognition apparatus 110 for liquid crystal panel. The mounting operation is executed by the operation control of the control device 180. The control device 180 is naturally acknowledged of a type of the liquid crystal panel 71 to be processed and a type of the electronic component 72 to be mounted to the liquid crystal panel 71.

[0142] In step (represented by “S”) 1 in FIG. 16, the deflection amount 197 of the liquid crystal panel 71 at points where the panel marks 191-1 and 191-2 are present is read out from the memory part 181. In step 2, the liquid crystal panel 71 held by the hold part 1121 through the suction operation by the suction device 1122 is moved by the panel hold device 112 to the image pickup device 111.

[0143] In the constitution where the deflection detection device 250 is installed to detect the deflection amount 197 as discussed above, step 1 is omitted and the deflection amount 197 is detected in step 2.

[0144] In step 3, the liquid crystal panel 71 is placed on the stage 1100. to correspond portions including the panel marks 191-1 and 191-2 of the liquid crystal panel to the stage 1100. When the liquid crystal panel is loaded, the Z-driving part 1123 is controlled to eliminate a deflection corresponding to the read out deflection amount 197, thereby adjusting a position of the hold part 1121 in the Z direction. The panel marks 191-1 and 191-2 are positioned to the bonding height position 193 when the liquid crystal panel 71 is loaded on the stage 1100.

[0145] In step 4, images of the panel marks 191-1 and 191-2 are picked up through the stage 1100 by the fixed camera 1201 and moving camera 1202, and picked information is sent to the control device 180 from the image pickup device 111. In step 5 subsequent to the pickup operation, according to the present embodiment, the liquid crystal panel 71 is temporarily released from the stage 1100 so as to prevent the electronic component 72 and the liquid crystal panel 71 from interfering with each other in operations of the following steps 6 and 7. The liquid crystal panel 71 is retreated from the stage 1100.

[0146] In step 6, the electronic component 72 held by the component hold device 160 is arranged so that the component marks 192-1 and 192-2 are positioned to the bonding height position 193 above the stage 1100. In step 7, images of the component marks 192-1 and 192-2 are picked up through the stage 1100 by the fixed camera 1201 and moving camera 1202.

[0147] In step 8 after the pickup operation, the electronic component 72 is retreated from above the stage 1100 so as to avoid the interference between the electronic component 72 and the liquid crystal panel 71 in the operation of next step 9.

[0148] In step 9, the liquid crystal panel 71 is placed on the stage 1100 so that the component mount portion of the liquid crystal panel 71 held by the panel hold device 112 is supported to the stage 1100. At this time, similar to step 3, the Z-driving part 1123 is controlled by the control device 180 to operate to eliminate the deflection on the basis of the deflection amount 197 at the side of the liquid crystal panel 71 where the component mount portion is present, or on the basis of the deflection amount 197 at the component mount portion. Moreover, the control device 180 obtains a position correction amount for the liquid crystal panel 71 based on recognition information of the panel marks 191-1, 191-2 and component marks 192-1, 192-2 recognized in steps 4 and 7 so that the electronic component 72 is mounted to a specified position of the component mount portion, thereby controlling the panel hold device 112.

[0149] In next step 10, the electronic component 72 held by the component hold device 160 is arranged at the specified position of the component mount portion and, pressed to the liquid crystal panel 71, whereby the electronic component 72 is mounted to the liquid crystal panel 71.

[0150] In the embodiment as described above, the liquid crystal panel 71 is located and placed on the stage 1100 so that the panel marks 191-1, 191-2 or the component mount portion coincides the stage 1100, and furthermore when placing on the stage 1100, on the basis of the deflection amount 197 of a part of the liquid crystal panel 71 where the panel marks 191-1 and 191-2 are present or where the component mount portion is present, the liquid crystal panel 71 is controlled in movement in the thickness-direction to eliminate the deflection amount 197. Therefore, the panel marks 191-1 and 191-2 can be recognized and the electronic component 72 can be mounted to the component mount portion in a state without or nearly without any deflection at the panel marks 191-1 and 191-2, or at the component mount portion. Since the panel marks 191-1 and 191-2 can be recognized with a higher accuracy than in the conventional art, an accuracy for mounting the electronic component 72 to the component mount portion can be improved as compared with the conventional art, and an inappropriate stress to the liquid crystal panel 71 when the electronic component 72 is pressed to the liquid crystal panel 71 in the mounting operation is eliminated.

[0151] In addition, the panel marks 191-1 and 191-2 are recognized in a state while the liquid crystal panel 71 is placed on the stage 1100 with the deflection eliminated. The panel marks 191-1 and 191-2 at this time are positioned to the bonding height position 193 as described above. On the other hand, the component marks 192-1 and 192-2 of the electronic component 72 are recognized in a state while positioned to the bonding height position 193. The panel marks 191-1, 191-2 and the component marks 192-1, 192-2 are picked up at the same bonding height position 193, and the electronic component 72 is mounted to the liquid crystal panel 71 at the bonding height position 193. An extra movement between the image pickup position and the mount position generated if the image pickup position and mount position are different is theoretically eliminated in the embodiment. An error in mechanism caused by the extra movement is hence prevented and the accuracy for mounting the electronic component 72 is improved in comparison with the conventional art.

[0152] Although the panel marks 191-1 and 191-2 are first picked up in the present embodiment as depicted above, the component marks 192-1 and 192-2 may be picked up first to shorten the Tact of the entire operation of the component mount operation, to reduce the number of operation times of the panel hold device 112 and to improve the mount accuracy. Further after the images of the component marks are picked up, the electronic component 72 can be retreated temporarily in a vertical direction and, then the panel marks 191-1 and 192-2 are picked up and the retreated electronic component 72 is moved down to perform the mounting.

[0153] In a component mounting apparatus of a combination of the above first and second embodiments, the suction irregularity to the transferred panels can be prevented and the mount accuracy for components to be mounted to the panels can be improved as compared with the conventional art, so that a quality of panels such as liquid crystal panels or the like can be improved in comparison with the conventional art.

[0154] Although the present invention has been fully described in connection with the preferred embodiments thereof with reference to the accompanying drawings, it is to be noted that various changes and modifications are apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present invention as defined by the appended claims unless they depart therefrom. 

1. A component mounting apparatus for mounting components to objects (8) through a plurality of processes, which comprises: transfer devices (6) for transferring each of the objects between the processes, each of transfer devices having transfer arms (6) with suction devices (12, 21) on which each of the objects is loaded and at the same time held by the suction devices, when each of the objects is transferred between the processes.
 2. The component mounting apparatus according to claim 1, wherein the transfer devices are arranged at positions opposite to working areas of the processes respectively, and transfer the objects completely processed at the working areas to positions opposite to next working areas after the objects are delivered to the transfer devices.
 3. The component mounting apparatus according to claim 2, which comprises move devices (10, 22) for supporting the objects at their lower side and moving the objects at least in an up-and-down and back-and-forth directions, and delivering the objects completely processed at the working areas to the transfer devices.
 4. The component mounting apparatus according to claim 3, wherein each of the move devices raises each of the objects loaded on the transfer arms up from the transfer arms and transfers the object to the working areas of processes, and transfers the objects to a higher position than the transfer arms above the transfer arms after completely finished at the working areas, lowers the object and places the object again on the transfer arms.
 5. The component mounting apparatus according to claim 1, wherein each of the transfer devices has two transfer arms for supporting the object at both end parts thereof.
 6. The component mounting apparatus according to claim 1, wherein the suction devices hold the object by vacuum suction.
 7. The component mounting apparatus according to claim 6, wherein each of the suction devices has pad parts (12), formed of a buffering material with upper end faces upper than a surface of the transfer arm, for sucking the object.
 8. The component mounting apparatus according to claim 1, wherein the object is a flat display panel.
 9. A component mounting method for mounting components to objects through a plurality of processes, the method comprising: holding lower sides of each of the objects; and transferring the held objects between the processes.
 10. The component mounting method according to claim 9, wherein the transfer is carried out with the use of transfer devices having transfer arms with suction devices in a state while the object is placed on the transfer arms and at the same time held by the suction devices.
 11. The component mounting method according to claim 10, wherein the object loaded on the transfer arms is raised up, thereby being separated from the transfer arms, then transferred to working areas of the processes, transferred to a higher position than the transfer arms above the transfer arms after completely finished at the working areas of the processes, lowered the object and placed the object again on the transfer arms.
 12. A recognition apparatus for component mount panel, which comprises: an image pickup device (111) for picking up images of panel marks (191-1, 191-2) on a panel (1) to which a component (2) is to be mounted, in a state while the panel marks are arranged at a bonding height position (193) in a thickness-direction of the panel when the component is mounted on the panel; a panel hold device (112) for holding and moving the panel to arrange the panel at the image pickup device for the image pickup; and a control device (180) for controlling the panel hold device to move to position the panel marks to the bonding height position with negating a deflection amount generated to the panel as a result of being held by the panel hold device when the panel is to be arranged at the image pickup device.
 13. The recognition apparatus for component mount panel according to claim 12, wherein the image pickup device comprises a light-passing stage (1100) where the panel is loaded to arrange the panel marks at the bonding height position when the panel marks are to be picked up, and cameras (1201, 1202) disposed opposite to the panel via the stage for picking up images of the panel marks through the stage.
 14. The recognition apparatus for component mount panel according to claim 13, wherein the panel marks are set by two, and the cameras have a fixed camera (1201) for picking up the image of one of the panel marks and a moving camera (1202) for picking up the image of the other panel mark which is movable to conform to an interval between the other mark and the one mark of the panel marks.
 15. A component mounting apparatus for liquid crystal panel, which comprises: an image pickup device (111) for picking up images of panel marks (191-1, 191-2) on a panel (1) to which a component (2) is to be mounted, in a state while the panel marks are arranged at a bonding height position (193) in a thickness-direction of the panel when the component is mounted to the panel, and moreover picking up images of component marks (192-1, 192-2) on the component in a state while the component marks are arranged at the bonding height position; a panel hold device (112) for holding and moving the liquid crystal panel to arrange the liquid crystal panel at the image pickup device for the image pickup; a component hold device (160) for holding and moving the component to arrange the component marks of the component at the bonding height position by the image pickup device for the image pickup, and moreover mounting the held component to the liquid crystal panel at the bonding height; and a control device (180) for controlling the panel hold device to arrange the panel marks at the bonding height position with negating a deflection amount generated to the liquid crystal panel because of being held by the panel hold device when the liquid crystal panel is to be arranged at the image pickup device.
 16. The component mounting apparatus for liquid crystal panel according to claim 15, wherein the image pickup device has a light-passing stage (1100) on which the panel is loaded to arrange the panel marks at the bonding height position when the panel marks are to be picked up and which becomes a support stage in mounting the component to the liquid crystal panel, and cameras (1201, 1202) disposed opposite to the panel and the component via the stage for picking up images of the panel marks and the component marks through the stage.
 17. The component mounting apparatus for liquid crystal panel according to claim 16, wherein the panel marks and the component marks are set each by two, and the cameras have a fixed camera (1201) for picking up images of either ones of the panel marks and component marks, and a moving camera (1202) for picking up images of the other ones of the panel marks and component marks which is movable to conform to an interval between the other mark and the one mark of the panel marks and component marks.
 18. The component mounting apparatus for liquid crystal panel according to claim 15, wherein the deflection amount is a value set for each side of the liquid crystal panel, so that the control device controls the panel hold device on the basis of the deflection amount set for the side where the panel marks to be recognized are present.
 19. The component mounting apparatus for liquid crystal panel according to claim 15, wherein the deflection amount is a value set at a mount portion for the component, so that the control device controls the panel hold device on the basis of the deflection amount set at the mount portion for the component.
 20. The component mounting apparatus for liquid crystal panel according to claim 15, which further comprises a deflection detection device (250) for detecting the deflection amount of the mount portion for the component at the liquid crystal panel before the liquid crystal panel is disposed to the image pickup device, so that the control device controls the panel hold device on the basis of the deflection amount supplied from the deflection detection device.
 21. A component mounting method for liquid crystal panel, which comprises: holding a liquid crystal panel (1) to which a component (2) is to be mounted; loading the liquid crystal panel to a light-passing stage (1100) as a support stage in a state where a deflection of the liquid crystal panel generated by the holding is eliminated; and mounting the component onto the liquid crystal panel loaded on the stage.
 22. The component mounting method for liquid crystal panel according to claim 21, whereby the liquid crystal panel is loaded to the stage in a manner to eliminate the deflection by reading out the already stored deflection amount of the liquid crystal panel.
 23. The component mounting method for liquid crystal panel according to claim 21, whereby the liquid crystal panel is loaded to the stage in a manner to eliminate the deflection on the basis of the measurement result by measuring the deflection amount of the liquid crystal panel.
 24. The component mounting method for liquid crystal panel according to claim 21, which further comprises: picking up through the light-passing stage images of panel marks (191-1, 191-2) of the liquid crystal panel positioned to a bonding height position (193) when the liquid crystal panel is loaded to the stage, after placing the liquid crystal panel to the stage as the support stage in a state to eliminate the deflection of the liquid crystal panel; picking up through the stage images of component marks (192-1, 192-2) of the component after arranging the component to position the component marks to the bonding height position; and mounting the component to the liquid crystal panel after a position correction for mounting the component onto the liquid crystal panel is executed on the basis of the picked up results of the panel marks and component marks. 